Products Die Bonder Our equipment helps to solve assembly challenges in all kind of markets, such as semiconductor backend, micro system technology, automotive, mobile telephony, industrial electronics and many more. Dicing Blades K&S offers a full range of hub dicing blades for a variety of advanced material applications. Bonding Tools Advanced bonding tools for a broad range of processes, from standard applications to ultra fine pitch. Wire Bonders/ automatic The industry's best wire bonders, bonding tools and bonding wire, combined with K&S process expertise. Wire Bonders/manual Digital and analog programming options—for ball, wedge, TAB & bumping—with your choice of features and capabilities. Stud Bumpers Take a closer look at the new K&S AT Premier™ Stud Bumper, your ideal choice for many flip chip product applications.