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C. Scott Kulicke Keynote Speech at SEMICONĀ® Singapore 2006
Published January 2006
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How the road to Singapore accelerated manufacturing in China
Published January 2006
Oded Lendner and Alan Schindler
Many integrated device manufacturers, material suppliers, and chip-packaging equipment companies are moving operations to the Chinese mainland at unprecedented rates. In pursuit of these opportunities, K&S has set up its own manufacturing operations in China over the past few years.
Published in Solid State Technology: Jan 2006
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Work Hard, Think Hard
Published September 2005
To succeed as an engineer, paper qualifications can take you only so far, the director of engineering at Kulicke & Soffa explains.
Published in The Straits Times Recruit: Sept 2005
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Kulicke & Soffa Industries: Still the Wire Bonding King
Published March 2005
K&S virtually invented the integrated circuit wire bonding business in the 1950s, and still leads the industry with its machines.
Published in Chip Scale Review: March 2005
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Proven Pioneers
Published January 2005
Kulicke & Soffa has what it takes to be a cutting-edge leader in the semiconductor industry. After all, it's been successfully maintaining market share for more than 50 years.
Published in US Business Review: Jan/Feb 2005
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Semiconductor Packaging Trends: Why the Future Must be Different than the Past
Published January 2005
C.S. Kulicke
If we just linearly extrapolate our current industry organization and culture, the industry won't successfully exploit coming advances in wafer fab technology.
Keynote presentation at IMAPS 2005
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K&S Looks for Growth in Outsourcing & Offshore
Published January 2004
K&S moves toward globalizing operations to better fuel its growth and lessen the impact of a cyclical industry.
Published in Manufacturing Today: Jan/Feb 2004
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10th Anniversary Insights: the Wire-Bonding Tyranny of "Or"
Published February 2002
Jack Belani
Many industry luminaries today debate what will be the interconnect technology of choice for semiconductor devices in the future. Is it going to be wire bonding or flip chip?
Published in Advanced Packaging Magazine: Feb 2002
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