Wire Bonding Basics

(English & Mandarin) Mishandling bonding wire products - from unpacking the boxes through handling on the production floor - continues to cause the majority of issues related to machine stoppages and wire bonding performance.

An animated look at the ball bonding process.

An introduction to the process steps required for wire bonding.

Chip-to-substrate interconnections provide the electrical paths for power and signal distribution. The most common interconnect technology is wire bonding, specifically ball bonding. Currently responsible for more than 90% of today’s chip interconnects, ball bonding continues to grow at a phenomenal rate.

Published in Advanced Packaging Magazine: July 2005