Stacked Die

Three dimensional ("stacked die") technology enables high performance "System in a Package" solutions for smaller, more functional products such as cell phones, PDAs and digital cameras.



Advanced Ultra-Low-Loop Wire Bonds Published January 2006 Bob Chylak, Lee Levine, Stephen Babinetz, O.D. Kwon Stacked die, die-to-die, and multi-tiered package demand has driven the development of over 20 premium-process wire bond loop shapes. Presented at SEMICON China 2006 Download
Ultra-low-loop Wire Bonds: Interconnect Solutions for Multi-Stacked Packages Published January 2006 Bob Chylak, Stephen Babinetz & Lee Levine The market for advanced, stacked-die packages continues to grow as portable electronic devices become more advanced. Stacked-die packages with as many as five die levels, and packages with up to 12 levels are being developed. Published in Advanced Packaging Magazine: Jan 2006 Download
Very Long, Ultra-Low Loop Testing for New Bonding Wire Development Published January 2006 Dodgie R.M. Calpito, Ivy W. Qin, Emily Pasamanero, Ei Phyu Phyu Theint and Tok Chee Wei The looping capability of bonding wires is constantly challenged in today’s advanced packages. Wire bonds up to 6 mm long and 100 mm low are demanded for advanced applications such as stacked die packages. Test and measurement techniques described in this study provide a systematic way of testing and characterizing wire performance for advanced looping applications. Presented at SEMICON Singapore 2006 Download
Stacked Die and Multi-Tier Applications Published October 2005 Yair Alcobi As the semiconductor industry moves from fine pitch to stacked die applications, looping profiles have become more complex. New and emerging bonding tools are being developed to positively impact the looping process in these challenging packages. Published in Advanced Packaging Magazine: Oct 2005 Download
Wire-Loop Shaping in Multi-Tier Packages Published August 2005 Stephen Tang and Gary Gillotti Current multi-tier devices in production consist of triple-tier bond-pad layouts, and quad-tier die are on the horizon. Chipmakers are finding that the multi-tier layout is more feasible from a wire-bonding standpoint than continuing to reduce pad pitches, since a triple tier of 60 µm pitched bond pads can have an effective 20 µm pitch. Published in Semiconductor International: Aug 2005 External Link
Wire Bonding Solutions for 3-D Stacked Die Packages Published May 2003 Stephen Babinetz The 3-D stacked die package has become the solution of choice in delivering smaller and more functional products to meet consumer demands, especially in the portable and handheld markets. As published in Electronics Manufacturing Engineering: Q3/2003 Download
Wire Bonding Solutions for Stack Die Packages: Numerical Simulation and Experimental Study of Overhang Configurations Published January 2003 Gary Schulze, Stephen Tang, and Ivy Wei Qin This paper focuses on wire bonding on overhang packages, one of the critical issues in stack die packaging. Presented at SEMICON Singapore 2003 Download
Assembly Solutions for 3-D Stacked Devices Published January 2002 Mark Klossner & Steven Babinetz The semiconductor industry has turned to system-on-chip (SoC) and system-in-package (SiP) designs to meet the needs of the portable and handheld markets. Presented at SEMICON West 2002 Download
Packaging Challenges and Solutions for Multi-Stack Die Applications Published January 2002 Bob Chylak and Ivy Wei Qin The continuous growth of stacked die packages is resulting from the technology’s ability to effectively increase the functionality and capacity of electronic devices within the same footprint as a single chip. Presented at SEMICON West 2002 Download