About K&S Wire Bonders

Array of K&S automatic wire bonders
Photo courtesy of ASE Group (Kaohsiung, Taiwan facility)

Support all processes that place physical demands on the chip’s bond pads.
Provide a total solution combining semiconductor assembly equipment with the complementing packaging materials that contact the surface of the customer's semiconductor devices.
Develop system solutions to the new technology challenges inherent in assembling and packaging next-generation semiconductors.

End Markets	Package	Needs/Drivers
Hand held, consumer	QFP, CABGA, CSP	Staggered Pitch, Matrix Manufacturing, Stacked Packages, Low Cost of Ownership
PC, Laptop, Peripherals, DVD, Set Top Box, Video Games	QFP, BGA, PLCC	High I/O, Fine Pitch, Long Wires, Low Cost of Ownership
Workstation, Internet Server	QFP, BGA, PGA	Highest I/O, Thermal Management, High Reliability, Lowest Cost