As an integral part of Kulicke & Soffa’s Wire Bonding Division, the Bonding Tools Group supplies innovative process solutions and designs state of the art Micro-Swiss brand bonding tools for a broad range of applications within the semiconductor industry.

Kulicke & Soffa Bonding Tools is a pioneer in the development of solutions for fine pitch applications and a world leader in ultra fine pitch solutions for complex packages such as BGAs and CSPs.

By combining more than 30 years of experience and expertise in design and manufacture of bonding tools, wire and equipment, K&S supplies its clientele with the best bonding solutions for any application.