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Fine Pitch bonding is geared for applications running from 60 um to 100 um.
Kulicke & Soffa is the dominant player in this category, possesing
about 80% of the worldwide market.
FP devices contain an abundance of wires sized from 0.8-1.2 mil. The tips of the FP capillaries can be as small as 3-4.8 mil, where the FA
is increased and the OR
is decreased. FP capillaries feature ICA of 90°.
Due to the delicate nature of the FP tool, it is manufactured from TA
and its BTNK
height is reduced to prevent breakage. As ways to balance the capillary break resistance versus performances, K&S Bonding Tools
allow great flexibility in the design of the BTNK radius, ranging from 90
to 120 tenths of a mil. As the pitches grow smaller the capillaries have
lower life spans (usually, FP capillaries do not exceed a life span of
200K -600K wires). To address this challenge, Kulicke & Soffa is
developing advanced solutions to significantly increase FP capillary
durability.
FP bonding is characterized by a wide array of applications such as BGA, QFP
and CSP. The wide range of applications creates specific application
requirements, which may vary from one customer to another. Here, there is
greater need for tool customization capabilities, specifically along
parameters such as FA, BTNK and OR. Hence, the K&S Bonding Tools CNC
production process allows maximum accuracy and flexibility in design
and manufacturing.
Kulicke & Soffa offers industry-leading tolerances for Hole and CD of FP
capillaries, producing exceptionally high accuracy standards and complying
precisely with customer specifications.
The FP bonding process is delicate and requires a certain level of
expertise.Kulicke & Soffa offers complete support for FP processes to
assist our customers in achieving maximum yields. The FP process undergoes
a long and complex optimization and is run on new and advanced machines
such as the K&S 8020 and 8028.
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