Bottleneck (BTNK) Capillary Bonding

The BTNK capillary is usually reserved for applications where the pad pitch is greater than 100 um. BTNK capillaries are appropriate for devices containing 100 or more wires (such as the QFP) sized 1.0-1.3 mil.

These capillaries are designed for applications requiring better access to the pad (due to finer pitches). To this end, K&S Bonding Tools offers flexible manufacturing capabilities for BTNK heights of up to 23 mil.

The BTNK capillary has the following features:

  • It is manufactured from Alumina or TA according to customer requirements.


  • Most BTNK capillaries have a Tip of 5.0-6.0 mil.


  • This capillary has a reasonable life span (in some cases as much as 1.5 million wires).


  • Unless specified otherwise, BTNK capillaries feature ICA of 120°. ICA of 90° is available on special request.


The BTNK optimization process is fairly simple and its maintenance does not require a high degree of bonding expertise.


See tolerances

 

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See BottleNeck Capillary Dimensions