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The UFP bonding process is performed on 35-50 µm applications using wires
sized 0.8 mil and below. UFP capillaries feature ICA of 90°.
Kulicke &Soffa is the leading supplier of compatible bonding tools for the most intricate
and delicate processes in the Ultra Fine Pitch arena. Capillaries for
applications 50 µm and below require state-of-the-art design and
manufacturing capabilities and are heavily dependent on uniquely developed
fine grain materials. Kulicke &Soffa material lab is executing
extensive research and development of advanced materials to support these
delicate bonding processes.
The UFP process is very sensitive to process variations and requires different
measurement and production techniques. While in FP processes the capillary
Hole
and CD
are defined in 1 tenth mil of an inch increments, the UFP process relies on more delicate
clearances. To this end, Kulicke &Soffa has developed Extra
Resolution (ER) measurement and manufacturing capabilities allowing
the customer to define the required Hole and CD in 0.5 tenth mil of an inch increments.
Kulicke &Soffa offers the tightest tolerances for the Hole and CD dimensions
of the UFP capillary and a complete solution for the optimization of
machine, wire and tool for these processes.
UFP bonding requires a long and complex optimization process and is
characterized by a narrow process window. It is run on the best and the
most advanced bonding machines in the world, such as the K&S
8028PPS.
K&S Bonding Tools manufacturing and inspection capabilities as well as our
application expertise allows us to offer the only solution in the industry
for operating bonding processes for
50 µm and below.
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