ACS LiteTM is developed for low-pin count applications, such as discrete & power integrated circuit applications using large wire diameters. ACS Lite features new ACS advanced material. With this new product, customers will benefit from
excellent bondability, robust consistent process thereby reducing their cost of ownership.

ACS Lite Application Range
· Bond Pad Pitch range: ≥120 [μm]
· Copper wire diameter range: up to 2.5mil
· Copper wire type: Any
· Large pitch package carrier families, such as low pin count
     lead frames, Power IC and LED

 ACS Lite Key Attributes 
· Improved workability (MTBA) & response consistency
    with large wire bonding performance
· Higher resistance to wear and more predictable life 

ACS Lite Major Benefits
· Competitive Cost of Ownership
    · Enhanced workability to help productivity
    · Improved material wear resistance for challenging