ACS MaxTM as part of the ACS series of advanced copper solution capillaries, enables our customers superior copper bonding quality with larger wire diameters and bond pad pitch requirements. The unique design of ACS Max allows a larger bond process window providing dynamic consistency and overall improved bondability throughout its usable life, thereby further reducing wire bonding cost of ownership.


ACS Max Application Range
· Bond Pad Pitch range: 70 – 120 [μm]
· Copper wire diameter range: ≤33 μm (≤1.3 mil)
· Copper wire type: Any
· Advanced package carrier families, such as Mid pin count 
    QFP, QFN, PPF, uPPF &Lead frames

ACS Max Key Attributes 
· Improved workability (MTBA) & response consistency 
    especially on 2nd bond performance
· New ITXTM material - superior properties of advanced 
    processing ceramics, enhances the capillary workability 
    and usable life
· High resistance to wear and more predictable life span

ACS Max Major Benefits
· Excellent bond-ability control
    · Advanced design rules to maintain 1st & 2nd bond 
        quality over time
· Improved process portability and response 

    · Design dynamics to ease the limited copper 
        process window
    · Consistent performance for smooth production fan-
· Competitive Cost of Ownership
    · Enhanced workability to help productivity
    · Improved material wear resistance for challenging