Products
ACS ProTM
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ACS Pro Best Fit Range
· Bond Pad Pitch range: 40 – 69 [μm]
· Copper wire diameter range: 0.6 – 1.0 [mil]
· Copper wire type: Any
· Advanced package carrier families, such as BGAs
 


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ACS 
ProTM
A new generation of copper capillary based on strong material development and application knowledge, which offers great operation benefits for advanced copper wire bonding applications.
 
ACS Pro Key Attributes 
· Ultra fine pitch design fit - a New Material for Longer 
    Life Span
· New ITXTM material - superior properties of advanced 
    processing ceramics, enhances the capillary workability
    and usable life
· High precision key features - controlled to satisfy the 
    most critical responses of fine copper wire bonding 
    requirements


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ACS Pro Major Benefits
· Excellent bond-ability control with fine wire diameters
· Advanced design rules to maintain 1st & 2nd bond
    quality over time
· Improved process portability and response 
    consistency

· Design dynamics to ease the limited copper process
    window
· Consistent performance for smooth production fan-out
· Competitive Cost of Ownership
· Enhanced workability to help productivity
· Improved material wear resistance for challenging 
     processes