As features and functionalities of ICs increases, driving higher I/Os, the trend for flip chip is moving towards pitches less than 100 μm needing higher accuracy flip chip bonding and alternative interconnect solutions. Designed with performance and accuracy in mind, K&S APAMA™ solutions provide higher accuracy and lower pitch bonding with market leading throughput.

The APAMA Series offers fully Automated Chip-to-Substrate (C2S) and Chip-to-Wafer (C2W) solutions for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC).


Modular designs allow the flexibility of upgrading from HD FOWLP or HA FC to TCB processes enabling effective cost-of-ownership and preserving the investments of our customers.
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