MORE THAN BONDING
As features and
functionalities of ICs increases, driving higher I/Os,
the trend for flip chip is moving towards pitches less
than 100 μm needing higher accuracy flip chip bonding
and alternative interconnect solutions. Designed with
performance and accuracy in mind, K&S APAMA™ solutions
provide higher accuracy and lower pitch bonding with
market leading throughput.
The APAMA Series offers fully
Automated Chip-to-Substrate (C2S) and Chip-to-Wafer
(C2W) solutions for Thermo-Compression Bonding (TCB),
High Density Fan-Out Wafer Level Packaging (HD FOWLP)
and High Accuracy Flip Chip (HA FC).
Modular designs allow the
flexibility of upgrading from HD FOWLP or HA FC to TCB
processes enabling effective cost-of-ownership and
preserving the investments of our customers.