Products
ATPremier™
  ATPremier MC.jpg

ATPremier™
Advanced Technology Stud Bumper 
 
K&S' ATPremier™ Stud Bumper offers many technological advantages that make it the ideal choice for a wide range of flip chip product  applications. Using the industrial standard modeling, this new generation high-speed stud dumper is the clear cost-of-ownership leader in comparison to competitive bumping technology.
 
Its "Premier" performance is highlighted by the following features.
 
   
 
         Features:
 
·         Quantum Leap in Bump Speed
·         Easy-to-Use-& Robust Wafer Mapping
·         Low-Impact Force for Bond Control
·         Bump Shape Process Flexibility
·         Short Product Changeover Time
·         Smallest Footprint in the Market
·         Step-and-Repeat Programming