AccuPlusTM Hub Blade
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* Customized Soluiton for thin, small die & backside coated
  discrete wafers
* Qaulity, precision and cost of ownership improvement
* Shortened pre-cut process for lower cost of ownership
* Two series of special nickel bond hardness
* Multi-levels of diamond concentration
* Special hub material and design enables high spindle
  frequency with less vibration
AccuPlusTM – New Hub Blades offer a customizable solution for discrete wafer dicing with improved efficiency and a lower cost of ownership.  
By optimizing key blade elements such as diamond grit size, diamond concentration, and nickel bond hardness, in conjunction with the newly introduced features, K&S AccuPlusTM blades deliver superior cut qality, bond life and cost of ownership improvement to the discrete wafer dicing market segment. 
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Data Sheets