Products

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Advanced Packaging Mass Reflow

PCB assembly meets Backend die placements. With actual passive shooting speeds of up to 121,000 passives per hour and flip chip shooting up to 27,000 flip chips per hour at placement defect rates lower than 1 defect per million, the Hybrid solutions gives you the best of both worlds.

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Wafer Level Packaging (WLP)

  • Bonding Flip Chips and/or Passives onto wafers or panels
  • Processing wafers sizes up to 12" and larger
  • Cam-X and Secs-Gem compatible
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Full traceability
  • Fine pitch Copper Pillar Bumps

 


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MCM & SIP/FC BGA/FC-CSP/
FC-Memory/FCOB

  • Up to 27,000 cph (IPC) Flip Chip bonding speeds
  • Up to 121,000 cph (IPC) Chip shooting speeds
  • High quality pick and placement process
  • 7 Micron for Flips Chips, Die and Wafer Level Packages
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Feeding from wafer, waffle pack, tray or tape and reel

 

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POP (Package-on-Package)

  • Die or BGA stacking at the highest throughput on smallest footprint
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full force control with every Placement at all placement height
  • Easy to exchange linear flux unit

  

 

 

Advanced Packaging - Hybrid
Hybrid MCM & SIP

A single machine solution for high volume Flip Chips or bare dies bonding also capable to add with SMD's placement.


Hybrid WLP

A single machine solution for WLP manufacturing. Flip Chips, Bare Dies or SMD's can be mounted on wafers up to 300 mm or panels up to 800 mm length.


Hybrid POP & Memory

A single machine solution for high volume Package on Package or memory devices.