With the increase in technology in the world today, it has become imperative that companies grow, adapt, and evolve to meet the ever-changing demands of the global electronics market.
K&S is one such company that values successful integration of electronic components into various devices, in the same way that we value our effective integration into the modern market. One of the best ways to prove our adaptability is through the display of the awards for which we have been recognized.
There are few awards that are as prestigious as the ones received by various manufacturers every year in the electronics realm, and we have accepted a few that prove our strategies for success are firmly set in place.
APA 2008 Best New Product Award
The K&S IConn High Performance Ball Bonder won the 2008 Advanced Packaging Award in the category of Best New Prodct in Wire Bonding Equipment and Materials
APA 2006 Best New Product Award
The K&S Maxµm Ultra High Performance Ball Bonder won the 2008 Advanced Packaging Award in the category of Best New Prodct in Wire Bonding Equipment and Materials
2006 Semiconductor International Best Product Award
K&S Maxum Ultra Ball Bonder earns Best Product Award,
APA 2004 Best Product Award
The K&S Maxµmplus Ultra High Speed Ball Bonder won the 2004 Advanced Packaging Award in the category of Wire Bonding Equipment, based on its ability to meet a significant industry challenge.
2002 Electronic Manufacturing Technology Award
Awarded to C. Scott Kulicke by the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society
Advanced Packaging Magazine Best Product Award
2001: Triton RDA (Ribbon Deep Access) Bonder
SEMATECH Total Quality Award
An EU-sponsored cooperative project for the European packaging industry
2001 Semiconductor International Best Product Award
K&S Maxum™ Ball Bonder earns Best Product Award, as nominated by our customers.