Products
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K&S Bonding Tools, a leading player in the semiconductors assembly industry, with over 40 years of experience.
 
We develop and manufacture advanced bonding tools ​for a broad range of applications, providing end - to - end solutions to a wide array of clients who are all market leaders in their respective fields.
 
Our product offerings vary from standard design to special solutions which address different packaging challenges and application conditions.
 
 
Bonding Tools
Quantis QFN

Latest copper wire bonding capillary


TeraCap

Dedicated for Advanced Memory and Logic Devices Using Gold/Silver Wire


VersaCap

Capillary for low-pin count applications, such as LED & discrete semiconductors micro-chips


ACS Pro

Copper capillary for High-pin Count & Fine Pitch, BGA & PBGA


iCap

The Latest Technology for Gold Wire Bonding Tool


ACS Max

Copper capillary for mid-pin count QFP, QFN, PPF, μPPF lead frames


LUMOS

a Dedicated Bonding Capillary for the LED Packaging Application


ACS Lite

Copper capillary for low-pin count applications, such as discrete & power IC