Products
CICTM
 
 
 
Features
 
Packaging Challenge: FP & UFP 1st bond reliability
BPP Range [μm]: [25 - 80]
WD Range [mil]: [0.45 - 1.3]
 
CICTM
Fine & Ultra-Fine Pitch 1st  Bond Reliability
 
Key Attributes
FP & UFP designs, for 80μm BPP and below
• Tip, Whole & Chamfer specially designed to improve
   the 1sst  bond responses
• Fits Gold and Copper wire application
 
Major Benefits
• Tighter 1st bond diameter control, with higher inter
   metallic coverage IMC)
Reduction in pad peeling and cratering 
Improved the 1st bond reliability
 
 Untitled 2.bmp