High Speed Large Area (LA) Wire Bonder for LED
The ConnXPS LED PLUSTM LA High Speed Large Area Wire Bonder is the second generation ball bonder introduced under the successful Power Series, which further sets new standards and benchmark in the LED market.
·        High Speed X-Y-Z motion control system
·        New Interactive Programmable Look-Ahead Vision for ease of setup during the first time
·        Automatic recovery paths for common production stoppages
·        WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting
·        Low angle oblique illumination
·        Single magnification optics at 2X
·        LED Advanced Loop and LED Advanced SSB Loop
·        Auto-BITS self-teach and optimization
·        Optional Micro Environment kit to support Ag alloy, PdCu or Cu wire