ConnX LED MC.jpg 
High Speed Wire Bonder for LED
The ConnX-LEDPS is built upon the new Power Series platform and is optimally designed for bonding LED. New features and enhancements that will help you increase efficiency and net productivity to meet the challenges in bonding LED.
As part of the Power Series, ConnX-LEDPS is designed for ease of use. Automatic functions have been added to let the bonder do more of the work in teaching and optimizing processes.  
·         High Speed X-Y-Z motion control system 
·         Programmable look-ahead vision algorithms for parallel bonding and vision functions
·         Dual-frequency transducer allows two selectable frequencies for each bond
·         Automatic recovery paths for common production stoppages
·         WAVI (Wide Angle Vertical Illumination system with programmable red and blue lighting
·         Low angle oblique illumination
·         Single magnificent optics at 2X
·         LED Advanced Loop and LED Advanced SSB Loop
·         Auto-BITS self-teach and optimization