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High Speed Wire Bonder
The ConnX High Speed Wire Bonder establishes new benchmarks for net productivity in low pin count, discrete and Cost Performance markets.
·         Extra large 56mm X 80mm bond area
·         ±3.0 µm accuracy
·         High Speed X-Y-Z motion control system
·         Programmable look-ahead vision algorithms for parallel bonding and vision functions
·         Dual-frequency transducer allows two selectable frequencies for each bond
·         Automatic recovery paths for common production stoppages
·         WAVI (Wide Angle Vertical Illumination system with programmable red and blue lighting
·         Low angle oblique illumination
·         Single magnificent optics at 2X
·         Optional copper wire bonding kit
Data Sheets