Products
ConnXPS
  ConnX MC.jpg
ConnXPS                                                                                        
High Speed Wire Bonder
 
The ConnX High Speed Wire Bonder establishes new benchmarks for net productivity in low pin count, discrete and Cost Performance markets.
 
 
 
 
  
Features
·         Extra large 56mm X 80mm bond area
·         ±3.0 µm accuracy
·         High Speed X-Y-Z motion control system
·         Programmable look-ahead vision algorithms for parallel bonding and vision functions
·         Dual-frequency transducer allows two selectable frequencies for each bond
·         Automatic recovery paths for common production stoppages
·         WAVI (Wide Angle Vertical Illumination system with programmable red and blue lighting
·         Low angle oblique illumination
·         Single magnificent optics at 2X
·         Optional copper wire bonding kit
 
 
Data Sheets