Products
CopperTM Hub Blade
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Features
 
Available in 0.6 mil to 5.0 mil Thicknesses
Exposures of 15 mil to 60 mil
2-6 µm to 4-8 µm Diamond Grid
Specially-Formulated "CU" Series Bond Hardness and Grit 
  Concentration
Available in AccuCut or Standard Hub, Both with AccuKerf
  Feature
 
Hub Blades for Copper Wafer Dicing 
 
Specially-formulated to resist loading when cutting copper-metallized wafers, the new CU Series hub blades reduce top and back side chipping.
 
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