Products

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Dicing Blades --- supported by our vast network of global resources and industry-leading expertise in all phases of back end semiconductor packaging and assembly, K&S dicing blade organization is structured to help you, in every way, improve yields, increase your productivity and attain higher profitability.

 

Dicing Blades
FCC

A Customizable Wafer Dicing Solution for Advanced Packaging


AccuPlus

Newly Launched Hub Blade -- A Customized Solution for Discrete Wafer Dicing


E-AccuPlus

Enhanced Hub Blades for Narrow Street Discrete Wafer Dicing


Silicon

Hub blade for today's most advanced silicon dicing


Opto

Opto Ceramic, Opto PCB


UniPlus Hub Blade

Hub blade tailored for quality and long-life cutting on package singulation materials


Copper

Hub blade for copper metalized wafer


UniPlus Hubless Blade

Breakthrogh from traditional package singulation solution