E-AccuPlusTM Blade
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Enhanced solution for Thin, Small die & backside 
           coated Discrete wafers
·         Solution for long life cutting
·         Ready for narrow saw kerf wafer dicing
·         Ease-of-choose part number system for lean 
·         Shortened pre-cut process for lower cost of ownership
·         New Hub design enables High Spindle Frequency 
E-AccuPlusTMEnhanced Hub Blades for Narrow Street Discrete Wafer Dicing, to Achieve Lower Cost of OwnershipE-AccuPlus Hub Blades series provide a differentiate solution to narrow street discrete wafer dicing for quality, precision and lower cost of ownership by deliver