Solutions
FO-WLP (Fan-Out Wafer Level Packaging)
  • Bonding Flip Chips and/or Passives onto wafers or panels
  • Processing wafers sizes up to 12" and larger
  • Cam-X and Secs-Gem compatible
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full controlled Placement force for thin Flip Chips or low profile passives
  • Full traceability
  • Fine Pitch Copper Pillar Bumps

Wafer Level Packaging.jpg

Recommended Products for the Solutions

Equipment