About Us
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A Vision Realized
 

During the year 1951, two men – along with $500 and a borrowed 1948 Plymouth Coupe formed a partnership that would
become a world leader of assembly solutions. They were Fred Kulicke and Al Soffa.
 
After five years of working together, Western Electric turned to K&S to develop equipment to efficiently manufacture
early semiconductor chips. What was created from the challenge was the world's first wire bonder. With this contract
K&S became one of the world's first suppliers of semiconductor assembly equipment, and the company incorporated
on November 26, 1956.
 
In 1961, K&S became a public corporation, traded on the pink sheets. In 1971, with the inception of NASDAQ, K&S became one of the first technology companies listed. Until today, K&S’ initial stock offering of 100,000 shares has grown to over 70 million after several stock splits and additional offerings. Today, K&S is the technology leader in assembly equipment with dominant market share positions in automatic ball bonding equipment, wedge bonding equipment and wire bonding tools.
 
K&S is truly a global company, with 2,950 employees and major manufacturing facilities in China, Malaysia and
Singapore. Over the years, K&S has expanded our product and service offerings to include bonding tools and dicing
blades. As in the past, K&S innovation combined with our emphasis on customer satisfaction, continue to set the
standard for the industry.
 
 
1951 Fred Kulicke & Al Soffa sign partnership agreement
1956 K&S incorporates as Kulicke & Soffa Company Inc. on November 26
1969 K&S established its first Israeli subsidiary in Haifa, Israel
1971 K&S becomes one of the first technology companies to list on the NASDAQ exchange
1972 Micro Swiss (K&S Bonding Tools) joins K&S
1972 First automatic wire bonder - K&S Model 1412
1981 K&S opens sales & service facility in Japan
1981 K&S introduces the 1482, a state-of-the-art automatic gold wire ball bonder
1995 American Fine Wire joins K&S
1996 Semitec (K&S Dicing Wheels) joins K&S
1996 K&S & Delco establish Flip Chip Technologies
2000 K&S introduces world's fastest, finest pitch wire bonders (8028s, 8028pps)
2000 K&S acquires Cerprobe and Probe Tech, and combines these entities to form the K&S Test Division.
2000 K&S opens Singapore manufacturing facility
2001 K&S launches e-commerce website
2002 Groundbreaking for K&S China manufacturing facility
2003 Grand Opening of First China-Based Manufacturing Operation
2003 K&S ships one million capillaries from China
2004 K&S sells flip chip business to FlipChip International, LLC 
2005 K&S launches next generation wire bonding and stud bumping machines
2006 K&S sells wafer test business to SV Probe and package test business to Investcorp.
2007 K&S Acquires Alphasem, a supplier of die bonding equipment, from Dover Technologies   International, Inc.
2008 K&S Launches the Power Series, a new generation of semiconductor assembly equipment.
2008 K&S completes sale of Wire Business to W.C. Heraeus GmbH 
2008 K&S completes acquisition of Orthodyne Electronics Corporation, a privately held, leading supplier of heavy wire wedge bonding equipment  
2010 Relocates Corporate HQ to Singapore
2012 Groundbreaking for the new Corporate HQ Building in Singapore 
​2014​​ ​Grand Opening of the K&S Corporate Headquarters Building
​2015 ​Expanding advanced packaging portfolio and diversifying into the automotive and industry markets through Advanced SMT
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