Reduce your SiP, MCM, WLP and flip chip production costs.
Where different equipment were used to place chips and known good dies for manufacturing of SiP, MCM, WLP and high performance flip chip modules, this can now be done on one single machine.
One machine solution, combining high speed chip shooting and flip chip bonding
  • Up to 27,000 cph (IPC) flip chip bonding speeds
  • Up to 121,000 cph (IPC) chip shooting speeds
High quality pick and placement process
  • no impact force during pick of known good dies or passive components
  • real-time closed loop placement force feedback on every placed component
  • down to 10 micron placement accuracy
  • > 98% first pass yield (at 2000 components per panel)