For Bonding Today, PLUS Tomorrow
IConnPS PLUSTM LA (Large Area) is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Wire Bonding today, PLUS tomorrow.

The IConn PLUS LA (Large Area) is designed to meet all leading edge wire bonding challenges. It has an extended bondable area to 87 mm, which is becoming an industry standard strip format.
·         Upgraded Control System that provides the latest available technology.
·         +/- 2.0 μm accuracy.
·         High Performance X-Y-Z motion control system.
·         Dual-frequency transducer allows two selectable frequencies for each bond.
·         Power Series Advanced Loops for tight control of the last kink height.
·         On-board process optimization tools.
·         1pF Auto-BITS self-teach and optimization.
·         WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting.
·         Optional programmable focus with a full 2.5 mm focus range.
·         Optional copper wire bonding kit.