Products
IConnPS PLUSTM
 
 
IConnPS PLUSTM
For Bonding Today, PLUS Tomorrow
 
IConnPS PLUSTM is the new State-of-the-Art in Fully Automatic Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Wire Bonding today, PLUS tomorrow.

IConn PLUS is designed to meet all leading edge wire bonding challenges.
Features
 
·         Upgraded Control System that provides the latest available technology.
·         +/- 2.0 μm accuracy.
·         High Performance X-Y-Z motion control system.
·         Dual-frequency transducer allows two selectable frequencies for each bond.
·         Power Series Advanced Loops for tight control of the last kink height.
·         On-board process optimization tools.
·         1pF Auto-BITS self-teach and optimization.
·         WAVI (Wide Angle Vertical Illumination) system with programmable red and blue lighting.
·         Optional programmable focus with a full 2.5 mm focus range.
·         Optional copper wire bonding kit.
·         Optional Large Area (LA) upgrade kit.