· Extra large 56mm X 87mm bond area
· ProCu Bond and ProCu SSB Processes (Patent Pending) New Easy to Use
– Response Oriented Copper Processes with High UPH for most applications.
· New “low flow” Cover Gas Flow design for the Widest Process Window with less
gas consumption (Patent Pending)
· High Precision Gas Regulation and Metering
· Pro-Process Library Files and Functions- Recommended Copper Bonding Processes
for 1st and 2nd bonds, and Looping. With Easy to Use tools for storing, cataloging, and
re-using golden processes.