IConn ProCuPS
ProCu MC  .jpg 
IConn ProCuPS
High Performance Copper Wire Bonder 
The State-of the-Art Performance of IConnPS
- the World's leading Wire Bonder - was the starting point for creating the most advanced copper wire bonding capability for today and tomorrow. This is the IConn ProCuPS.
Using development tools such as Computational Fluid Dynamics and Advanced Sensor Mechanics, the IConn ProCu employs a combination of precisely designed new hardware, optimized pneumatics, and complex process controls to provide the most advanced system available for wire bonding with copper wire.
·         ProCu Bond and proCu SSB Processes (Patent Pending) New Easy to Use
        – Response Oriented Copper Processes with higher UPH for most applications
·         New “low flow” Cover Gas Flow design for the Widest Process Window with less
        gas consumption (Patent Pending)
·         High Precision Gas Regulation and Metering
·         Pro-Process Library Files and Functions – Recommended Copper Bonding Processes
        for 1st and 2nd bonds, and Looping. With Easy to Use tools for storing, cataloging, and re-using golden