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High Performance Wire Bonder
As its name implies, the IConnPS High Performance 
Wire Bonder, represents the state-of-the art in IC
inter-Conn-ect performance for the advanced
packaging requirements for both today and tomorrow. 

·         Extra large 56mm X 80mm bond area
·         ±2.0 µm accuracy
·         High Performance X-Y-Z motion control system
·         Dual frequency transducer allows two selectable frequencies for each bond
·         Power Series Low Loop allowing forward loops under 50µm in height
·         On-board process optimization tools
·         Auto-BITS self-teach and optimization
·         WAVI (Wide Angle Vertical Illumination system with programmable red and blue lighting
·         Optional programmable optics with a full 2.5mm focus rang
·         Optional copper wire bonding kit
Data Sheets