The many advantages of the LED especially its lower energy consumption and longer lifetime have presented an opportunity for Green Energy to reduce the current carbon footprint produced world wide. Legislations have been put in place by many governments to encourage the use of LED as an efficient light source.
LED has found many applications in the current world such as Back Light Unit in Display Unit (TV, PC, Laptop and Mobile Phone), Interior / Exterior of Automobiles, Traffic Signals, Street Lights and Residential Lights.
There are various methods in the LED assembling; namely on leadframes, pre-molded leadframes, FR4 substrates, Ceramic substrates and Silicon substrates in the forms of Surface Mount Devices (SMD packages). Development in the area of Ceramic and Silicon substrates are gaining momentum now due to the inherent properties of conducting the heat efficiently from the LED package. Thermal Management of the LED packages is key in enabling the LED to emit lights efficiently throughout its perceived lifetime.
It is also important to note that Optocoupler and Photocoupler are considered as LED even though their lights are invisible to the human eyes. They are essentially used in the remote control for most of the electronic devices in today’s world.
In keeping up with K&S tradition of maintaining innovation and technological leadership in the Semiconductor market; an optimized bonder in maximizing the productivity in bonding LED devices was introduced; ConnX-LED. Unique solutions catering to the special needs in the LED market were designed into the ConnX-LED to achieve excellent Cost of Ownership by delivering the highest productivity and uptime machine in the LED market.