Chan Pin Chong
Senior Vice President, AP-Hybrid, Electronics Assembly, Wedge Bonders, Capillaries and Blades Business Lines
Chan Pin was appointed as Senior Vice President of K&S’s AP-Hybrid, Electronics Assembly, Wedge Bonders and Consumables Business Lines in December 2016.
He joined K&S in 2014 as Vice President of Wedge Bonders business group and has successfully turnaround the business and led the team to higher growth by diversifying the business into the battery bonding market.
Chan Pin is a technology industry veteran with more than 24 years of engineering and operations experience in the semiconductor and electronics industry. He started his career first as a Process and Test Engineer at Motorola Pagers and Cellular group and pioneered multiple factories in Asia before advancing to the role of Manufacturing Manager at Flextronics. In 1999, Chan Pin joined KLA-Tencor and held a number of diverse positions, including Senior Technical Director of Engineering and General Manager of Strategic Business Unit in Greater China. Chan Pin then pioneered the efforts of starting the MEMS factory in Singapore when he became the Vice President of Sales and General Manager at Form Factor. Most recently, he was the Global President & CEO at Everett Charles Technologies, managing and leading in test and probe technologies.
Chan Pin received his bachelor's degree in Electrical Engineering and Computer Science from the State University of New York at Buffalo and a master's degree in Business Administration from the University of Leicester, United Kingdom. A Singaporean national, he is a military reserve (National Service, NS) Brigade 2nd in Command of a combined arms division.