Solutions
PoP  (Package-on-Package)
Proven solution in production with CPU-GPU POP and applicable to memory POP.
  • Die or BGA stacking at the highest throughput on smallest footprint
  • Feeding from wafer, waffle pack, tray or tape and reel
  • Full force control with every Placement at all placement heights
  • Easy to exchange linear flux unit

 

Hybrid 3 Memory 2 TPR.jpgHybrid PoP.jpg



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