Orthodyne Semiconductor Wedge and PowerRibbon® Bonders are without a doubt the fastest and most productive bonders in the industry. They feature state-of-the-art motion control technology, intuitive software and real-time process monitoring for power leadframe applications, from single row TO-220 to multi-row PDFN to wide DIP IPM leadframes. Bonders can be easily configured as single, dual or multi-head systems.
Excellent quality monitoring capability is provided, with one to four in-line non-destructive pulltesters per bondhead. To push quality assurance to its peak, the optional Bond Process Monitoring (BPM) system is also available.
K&S’ focus on the rapidly-evolving power semiconductor industry results in new equipment and processes that meet the highest standards for process stability, economical cost of ownership and flexibility to adapt to any market demands.