Products
SiliconTM Hub Blade
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Features
 
A Wide Range of Grit Sizes 
Variable Bond Hardness 
Choose From 3 Different Diamond Concentrations 
AccuKerf™ Blades

 
Hub Blades for Silicon Wafer Dicing 
  
K&S offers a full range of dicing blade for silicon wafer. Grit sizes, diamond concentrations, bond hardnesses, and hub configurations are optimized to deliver maximum cut quality, throughput and blade life. 
 
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