Ultra Fine Pitch Wire Bonding
Ultra fine.jpg

Ultra Fine Pitch Wire Bonding
The K&S IConn Power Series ball bonder a leader in ultra fine pitch bonding. In such cases, in-line pitch goes as low as 40um, 35 and even 30um. A state-of-the-art bonder that is accurate, the IConn Power Series achieves an ultra fine pitch production capability. With such, it bonds on very small pads and sensitive oxide layers.
K&S uses an advanced servo control system to allow the bonder to bond accurately with excellent consistencies. The ultrasonic system consists of light and response transducers, permitting bonding on sensitive pads that are low-k or devices with circuit under pad.
Offering this solution to allow improved time-to-market package and process development, the K&S IConn Power Series ball bonder remains a top choice in the sector of ultra fine pitch bonding.
Recommended Products for the Solutions


Bonding Tools