Products
IConnPS ProCu PLUSTM LA
ProCu MC  .jpg 
 
IConnPS ProCu PLUSTM LA
For Copper Today, PLUS Tomorrow
 
IConnPS ProCu PLUSTM LA is the new State-of-the-Art in Copper Wire Bonding. With its upgraded and enhanced subsystems, it is engineered to deliver all the capability you will need -- For Copper today, PLUS tomorrow.

IConn ProCu PLUS LA is prepared to handle all leading edge copper bonding challenges. Extending the bondable area will help to increase efficiency and net productivity to meet the challenges in advanced packaging.

Our new ProCu5 process offers the highest level of Copper Process Capability available. It has many added controls and improvements over all existing ProCu processes. ProCu5 enables robust wire bonding production for Advanced node wafers down to 28 nanometer or below.
Features
 
·         Extra large 56 mm x 87 mm bond area.
·        
ProCu Bond and ProCu SSB Processes (Patent Pending) New Easy to Use -- Response Oriented Copper 
        Processes with Higher UPH for most applications.
·         Enhanced Gas Delivery System design for optimal Free Air Ball Formation and the most optimal level of
        cover gas consumption.
·         Programmable Pneumatics Gas Regulation and Metering.
·         Pro-Process Library Files and Functions – Recommended Copper Bonding Processes
        for 1st and 2nd bonds, and Looping. With Easy to Use tools for storing, cataloging, and re-using golden 
        processes.