· Extra large 56 mm x 87 mm bond area.
· ProCu Bond and ProCu SSB Processes (Patent Pending) New Easy to Use -- Response Oriented Copper
Processes with Higher UPH for most applications.
· Enhanced Gas Delivery System design for optimal Free Air Ball Formation and the most optimal level of
cover gas consumption.
· Programmable Pneumatics Gas Regulation and Metering.
· Pro-Process Library Files and Functions – Recommended Copper Bonding Processes
for 1st and 2nd bonds, and Looping. With Easy to Use tools for storing, cataloging, and re-using golden