K&S
Bonding Wire:
Reliability Comparison
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Bonding
Conditions |
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| Metalization:
Bond Pad Pitch: Bonded Ball Diameter: Wire Diameter: Bonding Temperature: |
0.5%
Cu, 99% Al 35µm 28µm 15µm 170oC |
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| Capillary: K&S M14CJ-2010-Z33-KSS Atlas | ||||