Dicing Blades


AccuPLUS™ Hub Blades offer a customizable solution for discrete wafer dicing with improved efficiency and a lower cost-of-ownership.

By optimizing key blade elements such as diamond grit size, diamond concentration, and nickel bond hardness, in conjunction with the newly introduced features, K&S AccuPLUS blades deliver superior cut qality, bond life and cost of ownership improvement to the discrete wafer dicing market segment.
Key Features:
  • Customized Soluiton for thin, small die, and backside coated discrete wafers
  • Qaulity, precision and an improved cost-of-ownership improvement 
  • Shortened pre-cut process
  • Two series of special nickel bond hardness
  • Multi-levels of diamond concentration
  • Special hub material and design enables high spindle frequency with less vibration

General Inquiries

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