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Dicing Blades

AccuPLUS

AccuPLUS™ Hub Blades offer a customizable solution for discrete wafer dicing with improved efficiency and a lower cost-of-ownership.

By optimizing key blade elements such as diamond grit size, diamond concentration, and nickel bond hardness, in conjunction with the newly introduced features, K&S AccuPLUS blades deliver superior cut qality, bond life and cost of ownership improvement to the discrete wafer dicing market segment.
Key Features:
  • Customized Soluiton for thin, small die, and backside coated discrete wafers
  • Qaulity, precision and an improved cost-of-ownership improvement 
  • Shortened pre-cut process
  • Two series of special nickel bond hardness
  • Multi-levels of diamond concentration
  • Special hub material and design enables high spindle frequency with less vibration

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.