Dicing Blades


Specially-formulated to resist loading when cutting copper-metallized wafers, the Copper hub blade reduces top and back side chipping.
Key Features:
  • Available in 0.6 mil to 5.0 mil thickness
  • Exposures of 15 mil to 60 mil
  • 2-6 µm to 4-8 µm diamond grid
  • Specially-formulated Copper series bond hardness and grit concentration
  • Available in AccuCut or standard hub, both with AccuKerf feature

General Inquiries

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