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Dicing Blades


Specially-formulated to resist loading when cutting copper-metallized wafers, the Copper hub blade reduces top and back side chipping.
Key Features:
  • Available in 0.6 mil to 5.0 mil thickness
  • Exposures of 15 mil to 60 mil
  • 2-6 µm to 4-8 µm diamond grid
  • Specially-formulated Copper series bond hardness and grit concentration
  • Available in AccuCut or standard hub, both with AccuKerf feature

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.