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Dicing Blades

E-AccuPLUS

E-AccuPLUS™ is an enhanced hub blade solution that is differentiated for narrow street discrete wafer dicing, to achieve a lower cost-of-ownership.
Key Features:
  • Enhanced solution for thin, small die, and backside coated discrete wafers
  • Solution for long life cutting
  • Ready for narrow saw kerf wafer dicing
  • Ease-of-choose part number system for lean manufacturing
  • Shortened pre-cut process for a lower cost-of-ownership
  • New hub design enables high spindle frequency applications

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.