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Dicing Blades


Nova™ hub blades are the immediate solution to the challenges posed by the dicing of low-k type materials by reducing chipping and delamination.
Key Features:
  • Improves low-k wafer dicing yields
  • Immediate solution using current dicing practices
  • Wide process window (feed rate and RPM)
  • Choice of three standard bond/grit matrices
  • Diamond grit from 2.0 - 6.0 µm
  • Available in 0.8 mil to 2.0 mil thickness

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.