Dicing Blades


K&S offers a full range of dicing blades for silicon wafer. Grit sizes, diamond concentrations, bond hardnesses, and hub configurations are optimized to deliver maximum cut quality, throughput and blade life.
Key Features:
  • Wide range of grit sizes
  • Variable bond hardness 
  • Choose from three different diamond concentrations 
  • ​AccuKerf™ blades

General Inquiries

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