Advanced Packaging (APAMA)


Advanced Packaging with Adaptive Machine Analytics - More than Bonding

As features and functionalities of ICs increases, driving higher I/Os, the trend for flip chip is moving towards pitches less than 100 μm needing higher accuracy flip chip bonding and alternative interconnect solutions. Designed with performance and accuracy in mind, K&S APAMA™ solutions provide higher accuracy and lower pitch bonding with market leading throughput.

The APAMA Series offers fully Automated Chip-to-Substrate (C2S) and Chip-to-Wafer (C2W) solutions for Thermo-Compression Bonding (TCB), High Density Fan-Out Wafer Level Packaging (HD FOWLP) and High Accuracy Flip Chip (HA FC).

Chip-to-Substrate Thermo-Compression Bonder

Chip-to-Wafer Thermo-Compression Bonder

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