Ball Bonder


Automatic High Speed Wire Bonder

The ConnX automatic high speed wire bonder establishes new benchmarks for net productivity in low pin count, discrete, and cost performance markets.
Key Features:
  • Extra large 56 x 80 mm bond area
  • ± 3.0 µm accuracy
  • High speed X-Y-Z motion control system
  • Programmable look-ahead vision algorithms for parallel bonding and vision functions
  • Dual-frequency transducer allows two selectable frequencies for each bond
  • Automatic recovery paths for common production stoppages
  • WAVI (Wide Angle Vertical Illumination system with programmable red and blue lighting
  • Low angle oblique illumination
  • Single magnificent optics at 2x
  • Optional copper wire bonding kit

Field Upgrade Path:
  • ConnX LA (Large Area)

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.