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Ball Bonder


Automatic High Speed Wire Bonder

ConnX PLUS automatic high speed wire bonder is a second generation ball bonder introduced under the highly successful Power Series, which further increases net productivity setting new standard and bench marks in the discrete, low-pin count, and cost performance markets.
Key Features:
  • Interactive Programmable Look Ahead Vision to ease first time set-up
  • Power Series Xpress Loop to help increase the productivity of short wire applications
  • Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices
  • 10% higher UPH (units per hour) over the first generation ConnX™ ball bonder

Field Upgrade Path:
  • ConnX PLUS LA (Large Area) to support 87 mm bondable area
  • ConnX PLUS ELA (Extended Large Area) to support 90 mm bondable area

General Inquiries

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