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Die Attach

APAMA DA (Image)

High Performance & High Productivity die attach

For Epoxy and Multi Die Bonding

Kulicke & Soffa's APAMA™ DA (Image) is the next generation platform that delivers industry leading throughput and best-in-class yields by leveraging unique advances in functionality.
Key Features
  • Parallel Processing
  • Post Pick Alignment and Inspection
  • Patented Dynamic Calibration Technology

General Inquiries

We are here to help. Please complete the inquiry form and we will direct you to the right team.